The Library Publishing Coalition (LPC) and the IFLA Library Publishing Special Interest Group (SIG) are delighted to announce an international scholarship for attendance at the 2026 Library Publishing Forum, to be held in-person in Seattle, Washington, USA, on June 17-18, 2026.
This scholarship is designed to support individuals from OECD-listed Developing Countries who have been engaged in library publishing programs for two years or more.
Scholarship Benefits
Recipients will receive full funding to attend the Library Publishing Forum and participate in related activities from June 2026 – May 2027, including:
- Round-trip economy airfare to Seattle, Washington from the recipient’s country of residence
- Accommodation in Seattle for the duration of the conference
- Conference registration fees
- Transportation costs to and from the Airport, and to and from the Forum (public transit, taxi)
- Meals: Some meals will be included in the conference, plus a stipend for other meals not included
- Cell phone roaming plan
- Visa fees
- Travel insurance
- Attendance at all online Library Publishing Coalition committees and events throughout the award period
Who Should Apply?
Applicants must:
- Reside and work in an OECD-listed Developing Country
- Have been working in library publishing for at least two years
- Be committed to participating remotely in Library Publishing Coalition activities from June 2026 – May 2027
- Be committed to presenting on the scholarship experience at an IFLA Library Publishing SIG event after the scholarship period.
How to Apply
Interested candidates must complete the Application Form.
The deadline for receipt of applications is Friday October 31, 2025.
Applications will be reviewed by a selection committee, and recipients will be notified in December 2025.
This scholarship presents a unique opportunity to engage with the international library publishing community, gain valuable insights, and contribute to the growth and development of library publishing in your institution and worldwide.
We encourage all eligible applicants to apply and look forward to welcoming the scholarship recipient to Seattle in 2026!